Schematic capture, stack-up planning, layout, and signal integrity — in Altium Designer or any EDA tool your team already runs on.
A board that looks right in 3D preview can still fail at speed. We plan stack-ups, impedance, and routing around your actual signal budget — not just component placement — so high-speed interfaces behave the same on the bench as they do in simulation.
Every layout goes through a design-for-manufacturing pass before release, so what we hand off is fab-ready, not "should be fine."
Component selection support, netlist structuring, and design reviews before layout begins.
Layer planning for controlled impedance, EMI control, and power/ground plane strategy.
Length matching, differential pairs, and via strategy for high-speed digital and RF interfaces.
Impedance and crosstalk verification against your interface's real timing budget.
Manufacturability and assembly checks so the board fabs and assembles cleanly, first pass.
Delivered in Altium Designer by default — KiCad or your internal tool on request.
| Primary tool | Altium Designer |
| Also supported | KiCad, Cadence Allegro, or client-specified tool |
| Layer counts | 2-layer through complex multilayer stack-ups |
| Deliverables | Gerbers, BOM, assembly drawings, source project files |
High-speed digital interfaces, RF front ends, dense multilayer boards, and designs where a previous layout didn't pass signal integrity or EMC testing.
We'll give you a real read on layer count, stack-up, and timeline before you commit to anything.
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